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Tag Archives: WIOMING
ST-Ericsson WIOMING 3D application processor provides breakthrough for graphic and CPU performances
ST-Ericsson has successfully tested its WIOMING 3D application processor. WIOMING – which stands for WideIO Memory Interface Next Generation – provides a major breakthrough for performance increase and power efficiency in low power mobile devices. Through silicon via (TSV) and … Read more
ST-Ericsson WIOMING 3D application processor provides breakthrough for graphic and CPU performances
Today, in cooperation with the CEA-Leti, ST-Ericsson announced a major breakthrough in 3D silicon stacking technology at the “3D Architectures for Semiconductor Integration and Packaging Conference.” ST-Ericsson has developed WIOMING, the first application processor integrated with the 3D WideIO technology … Read more